Thermal performance of a phase change material-based heat sink in presence of nanoparticles and metal-foam to enhance cooling performance of electronics

The present study explores the parametric investigation of a heat sink filled with composite pure phase change material (PCM), nanocomposite (NCPCM), metal-foam (MF) by employing numerical approach for effective passive thermal management electronics. combinations are varied filling PCM, NCPCM, MF+PCM and NCPCM+MF. Different parameters such as MF materials, porosities, pore densities (PPI-pores per inch), volume fractions nanoparticles in power levels combination MF+NCPCM varying different porosities fractions. Copper (Cu) 1%, 3% 5% fraction were dispersed RT-35HC, used copper, aluminium (Al) nickel (Ni) MFs embedded inside sink. Transient simulations conjugate transfer melting/solidification schemes formulated using finite-volume-method (FVM). performance melting process NCPCM evaluated through time, storage capacity, density, rate density. results showed that addition Cu MF, was increased time reduced. reduced −1.25%, −1.87% −2.34%; is enhanced 1.35%, 0.76%, 0.19% nanoparticles, respectively. lower temperature higher liquid-fraction obtained. latent-heating duration decreased increase fraction. Additionally, reduction −18.10% 8.12% obtained 1% 95% porosity 10 PPI based